Engineering Services
We use the most advanced tools available to assist with the design and verification of each product. The objective is to have
products work properly after fabrication. The bulleted list of items shown below, illustrate our experience from projects we
have completed. We are certainly not limited to these areas, and eagerly look forward to new challenges and technologies.
Hardware Services Include:
- Product , Analog and Digital Designs
- Feasibility study
- Proof of concept
- Bread boarding/Prototype assembly
- Design verification
- IBIS simulations (via Hyperlinx) - IBIS models are available for all modern chip designs and define the timing inside the chip. Hyperlinx is used to perform detailed timing verifications of entire schematics as networks of inter-connected IBIS models.
PCB Development:
- PCB design and layout using Zuken Cadstar
- PCB timing verification using Hyperlynx
- Gerber File generation
- Schematic capture (Viewlogic/ Orcad)
- High speed PCB design verification with Hyperlynx
Mechanical Engineering:
- Mechanical Packaging Design with certified Solidworks professionals
- 2D - 3D modeling and rendering
- Prototype plastic molding
- Tool & Die Design
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Areas of expertise
- Project Engineering / Management
- Hardware, Software, Mechanical Design and Development
- Six Sigma Analytical Methodology
- Product Life Cycle Managemenit
- Proof of Concept Models
- Low noise/ Low signal level Analog design
- Custom/Semi-Custom Voltage regulators and power supplies
- Analog, Digital and hybrid designs
- Altera, Actel, Xlinx FPGA
- DDR2 & DDR3 memory
- Microcontrollers
- 32 bit processors, X86, ARM7, ARM9, MIPS
- 16 bit processors MSP430, 80C186, Intel-Atom
- 8 bit processors, PIC, 8051, AVR
- DSPs processors, TI C642 Video processor
- Analog Devices Black Fin
- ASIC & FPGA Design/Verify
- VHDL design entry
- Standard Cell technology
- Modelsim
- Hyperlinx
- Test vector generation
- Automated test bench design
- Altera, Xilinx, Actel FPGA
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Electronic Interfaces
- A/D D/A Converters
- Communications
- Thermocouple Interfaces
- Magnetostrictive Level sensing
- HDMI / DVI, Component, SVIDEO, PAL / NTSC video
- Sensor Interfaces
- Custom/Semi Custom
- Temperature: RTD, Thermocouple, Thermister
- Magnetostrictive Level sensing
- Ultrasonic
- TDR (Time Domain Reflectometry)
- Peizo electric sensors
- Developed patented technology
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Reverse Engineering
- Hardware
- Analysis of existing circuitry
- Generate Schematic from Analysis
- Verify functionality with Simulation
- Adjust and iterate as needed
- Software
- Analysis and configuration of porting tools
- Compile and test on new platform
- See Porting Tools
- Mechanical
- Designs to fit existing geometry
- Improving or modifying designs where no CAD exists
- Creating Mirrorr components
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